Prof. Guo-Quan Lu, IEEE Fellow, Virginia Polytechnic Institute and State University, USA
Speech Title: Materials Research and Manufacturing Opportunities for Power Electronics Integration
Abstract: Power electronics (PE) researchers constantly strive to improve the efficiency, power density, and reliability of power converters by integrating semiconductor switches, electrical components, and circuit designs. Materials are fundamental to enable their innovations. A good example is the recent advances made in SiC and GaN wide bandgap (WBG) semiconductor materials which led to a rapid growth of research and commercial activities in WBG-based PE. The fast, low-loss, and high-temperature WBG switches promise tremendous energy savings and system miniaturization. However, to fully realize the potential of the WBG switches, materials innovations are needed for the integration technologies of power converters, such as interconnection and protection of the active switches and embedding of passive components. Over the past twenty years, the materials research group at Virginia Tech’s Center for Power Electronics Systems (CPES) has pursued research opportunities by addressing the challenges of packaging and integration of WBG PE. In this presentation, I will highlight our efforts in the development of two types of materials, a nanosilver paste for device interconnection and magnetic feedstock for additive manufacturing of power magnetic components. The interconnect material, which can be sintered below 250oC without pressure, enables ease of bonding the PE switches for high thermal and electrical performances, high reliability, and high-temperature capability. The scientific basis, practical challenges, and application successes of the interconnect material will be presented. On the magnetic material, I will describe our processing approaches for making various powder-iron and ferrite paste formulations, which after heating without pressure, form cores with wide-ranging magnetic properties. I will show the use of the magnetic pastes as feedstock in a multi-extrusion 3D printer for rapid-prototyping custom magnetic cores and components.
Biography: Dr. Guo-Quan (GQ) Lu is a professor jointly appointed between the Department of MSE and the Bradley Department of ECE at Virginia Tech. He has a double-major BS degree in Physics and MSE from Carnegie-Mellon University and Ph.D. in Applied Physics/Materials Science from Harvard University. He worked at Alcoa Technical Center before joining Virginia Tech. Dr. Lu has published over 180 peer-reviewed journal articles. He won a Virginia Tech teaching award and a National Science Foundation CAREER award. His development of a nanoscale silver paste was recognized with an R&D 100 award in 2007. Dr. Lu is an IEEE Fellow.
Prof. Andrew Y C Nee, National University of Singapore, Singapore
Speech Title: Digital Twin – current state and future trends
Abstract: Digital twin (DT) is an emerging and fast growing technology which provides a promising way to connect and integrate physical and virtual spaces seamlessly. In brief, a DT is a digital representation of a physical object or system. It has bi-directional communication capability with the physical twin through sensors and networks. This talk presents an introduction of the DT applications, in particular, manufacturing activities such as maintenance and control of equipment, and addresses future trends in other fields like healthcare and smart cities.
Biography: Andrew Y C Nee is currently Emeritus Professor of National University of Singapore. He has served as Head of Mechanical Engineering and Dean of Faculty of Engineering. He has graduated 53 PhD and 47 Masters students, published over 500 papers with GS citation of 18860 and H-Index 71. His research activities are in augmented reality, digital twin and manufacturing simulation. He is a Fellow of CIRP (served as its President in 2012), Fellow of SME (Gold medal recipient in 2014) and Fellow of Academy of Engineering Singapore. Currently, he is Editor-in-Chief of International Journal of Advanced Manufacturing Technology (Springer), and Executive Editor-in-Chief of Advances in Manufacturing (Shanghai-Springer).
Prof. FU Ming Wang, The Hong Kong Polytechnic University, China
Speech Title: Damage And Fracture in Multi-Scaled Materials Processing and Manufacturing
Abstract: Damage and fracture are related to multi-scaled fabricated parts design, manufacturing process determination and parameter configuration, tooling design and product quality control and properties tailoring. Therefore, an in-depth understanding of damage and fracture behaviors and an extensive insight into the formation and occurrence mechanisms of the damage and fracture is crucial in multi-scaled materials processing and manufacturing. In this talk, the mechanisms of initiation, coalesce, growth and development of voids in plastic deformation, formation and occurrence of damage and fracture, behaviors of damage and fracture in multi-scaled deformation, prediction criteria of damage and fracture, and prediction and avoidance of damage and fracture related defects via modeling, simulation and analysis base on case studies will be presented. The talk will give an overview of the state-of-the-art in damage and fracture.
Biography: Prof Mingwang Fu (M.W. Fu) received his BEng and MEng from the Northwestern Polytechnical University, China, and PhD from the National University of Singapore. Before he went to Singapore for his career development, he had worked in China as a faculty member and conducted many projects funded by governmental agencies and industries, and was promoted to Associate and Full Professor via the fast track promotion scheme in 1992 and 1995, respectively. In 1997, he joined the Singapore Institute of Manuf. Tech. as a Senior Research Engineer. In 2006, he joined The HK Polytechnic University as a faculty member. Prof Fu’s research endeavor is more on exploring advanced materials processing, numerical modeling and simulation, product design and development, and micro-mechanics to seek an epistemological understanding of the science behind these explorations, advancing knowledge in these arenas, and successfully addressing a plethora of challenges and bottleneck issues the explorations face. Prof. Fu is sitting in the editorial board of a number of longstanding SCI journals including Int. J. of Plasticity, Mater & Design, Int. J. of Damage Mechanics, Int. J. of Adv. Manuf. Tech., and the editor of Elsevier’s Encyclopedia of Materials-Metals and Alloys. He has more than 200 papers published in SCI journals with more than half of the papers published in the top 10% SCI journals in the corresponding SCI disciplines, and published 5 monographs by the top-notched publishers including, Springer-Verlag London Ltd, CRC Press, Taylor & Francis Group, and given more than 40 keynote/plenary talks in different conferences and institutions in his research areas since 2000.
2022 Keynote Speakers
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